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Research interest and experience

Development of wafer-scale 2D semiconductor materials

  • Fabrication of 2D material, Molybdenum disulfide (MoS2) and Tungsten disulfide (WS2)

  • Analyze structural, and optical properties of 2D materials

  • Large-scale 2D material layer transfer

My major for Ph.D in RMIT was "Large area fabrication of electronic-grade metal oxides".

  • Development on high quality of crystalline oxide thin film by ultrasonic spray pyrolysis.

  • Enhanced optoelectronic properties of n-type doped tin oxide thin film and p-type ternary Cu delafossite by doping concentration, deposition temperature and deposition film thickness.

  • Characterization of structural, electrical, optical and mechanical properties of TCO thin film.

In the past year of effort, my previous work was focusing on the development of low temperature process using nanoscale-based copper materials (NTU-Lockheed Martin Joint Lab, Singapore).

  • Development of low temperature bonding process using nanoparticle-based Cu paste for interconnects (Samsung electronics, 2017~2017, Korea).

  • Characterization of electrical and mechanical properties of low temperature sintered nanoCu film/Polyimide using nanoCu conductive ink for flexible device (NRF PROOF-OF-CONCEPT GRANT, 2016~2017, Singapore).

  • Fabrication of high aspect ratio of copper nanowire array via an electroplating method.

  • Development copper nanoparticle ink for printing antenna application.

Skills

Thin film deposition equipment

  • Ultrasonic spray coater for transparent conductive oxide layers
    (Types of metal oxide with dopant, *metal : SnO2, ZnO, TiO2 and Fe2O3 thin layers)

  • Spin coating

  • Sputter deposition (PVD75)

  • Metallic ink printing 

  • Electroplating deposition for Cu, Sn, and Cu nanowires

  • Paste dispenser

  • Reaction sputter deposition

  • Chemical vapor deposition

 

Characterization equipment

  • Atomic Force Microscopy (AFM)

  • Scanning Electron Microscope (SEM), Energy dispersive X-ray (EDX)

  • Focused Ion Beam(FIB)

  • X-ray diffraction (XRD)

  • X-ray Photoelectron Spectroscopy (XPS)

  • Sheet resistance by 4-point probe

  • Hall effect measurement system

  • UV-Vis-NIR spectrometers (standard and integrating sphere)

  • Mechanical tensile tester

  • Nano-indentation for mechanical properties (elastic modulus and hardness)

  • Thermogravimetric analysis (TGA)

  • Differential scanning calorimetry (DSC)

Software

  • Microsoft office

  • Originlab

  • Vesta

  • Fiji (ImageJ)

  • RStudio for data science

© 2020 by Jaewon Kim

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