Jaewon KIM

Jaewon Kim, "Texture changes of fluorine-doped tin oxide (FTO) coatings using ultrasonic spray pyrolysis", Ceramics International, 50, 20, 38342-38349, (2024) (https://doi.org/10.1016/j.ceramint.2024.07.198).

Jaewon Kim, Gahui Kim, Young-Bae Park, "Structural, optical, electrical, and nanomechanical properties of F-doped SnO2 fabricated by ultrasonic spray pyrolysis", Electronic Materials Letters, 20, 402-413, (2024) (https://doi.org/10.1007/s13391-024-00489-w).

Jaewon Kim, Owen Kendall, Triet Thien Huu Nguyen, Joel van Embden, Enrico Della Gaspera, "Improved Transparency and Conductivity in Copper Chromium Oxide Coatings through Aliovalent Doping and Stoichiometry Control", RSC Applied Interfaces, 1, 502-510, (2024) (https://doi.org/10.1039/d3lf00227f).

Mingxi Chen, Jianwei Chai, Jing Wu, Haofei Zheng, Wen-Ya Wu,  James Lourembam, Ming Lin, Jun-Young Kim, Jaewon Kim, Kah-Wee Ang, Man-Fai Ng, Henry Medina, Shi Wun Tong and  Dongzhi Chi, "Sublimation-based wafer-scale monolayer WS2 formation via self-limited thinning of few-layer WS2", Nanoscale Horizons, 9, 132-142, (2023) (https://doi.org/10.1039/D3NH00358B).

Jun-young Kim, Mingxi Chen, Wei De Wang, Poh Chong Lim, Jaewon Kim, Jianwei Chai, Mingsheng Zhang, Siew Lang Teo, Ming Lin, Dongzhi Chi, “Strong (110) texturing and heteroepitaxial growth of thin Mo films on MoS2 monolayer” ACS Appl. Electron. Mater. 4, 10, 5026–5033, (2022) (https://doi.org/10.1021/acsaelm.2c01019).

Jaewon Kim, Owen Kendall, Jiawen Ren, Billy J. Murdoch, Christopher F. McConville, Joel van Embden, and Enrico Della Gaspera, "Highly Conductive and Visibly Transparent p‑Type CuCrO2 Films by Ultrasonic Spray Pyrolysis", ACS Appl. Mater. Interfaces, 14, 9, 11768–11778, (2022), (https://doi.org/10.1021/acsami.1c24023).

Jaewon Kim, Sherman Wong, Gahui Kim, Young-Bae Park, Joel van Embden, Enrico Della Gaspera, "Transparent electrodes based on spray coated fluorine-doped tin oxide with enhanced optical, electrical and mechanical properties", Journal of Materials Chemistry C, 8, 14531-14539, (2020), (https://doi.org/10.1039/D0TC03314F)

Jaewon Kim, Billy J. Murdoch, James G. Partridge, Kaijian Xing, Dong-Chen Qi, Josh Lipton-Duffin, Christopher F. McConville, Joel van Embden, Enrico Della Gaspera, “Ultrasonic Spray Pyrolysis of Antimony-Doped Tin Oxide Transparent Conductive Coatings “, Adv. Mater. Interfaces, 7, 18, 2000655 (2020).  (https://doi.org/10.1002/admi.202000655), Cover page (https://doi.org/10.1002/admi.202070104)

Aaron Elbourne, Samuel Cheeseman, Pierce Wainer, Jaewon Kim, Alexander E. Medvedev, Kylie. J. Boyce, Christopher F. McConville, Joel van Embden, Russell J. Crawford, James Chapman, Vi Khanh Truong, and Enrico Della Gaspera, “Significant Enhancement of Antimicrobial Activity in Oxygen-Deficient Zinc Oxide Nanowires:, ACS Appl. Bio Mater., 3, p. 2997−3004 (2020).
(https://doi.org/10.1021/acsabm.0c00065)

Jong-Myeong Park, Jae-Won Kim, and Young-Bae Park, "Effects of Wet Treatment Conditions and Pattern Densities on Interfacial Bonding Characteristics of Cu-Cu Direct Bonds", Japanese Journal of Applied Physics, VOl. 53, 05HB07 (2014).  (http://dx.doi.org/10.7567/JJAP.53.05HB07)

Jae-Won Kim, Myeong-Hyeok Jeong, Young-Bae Park, “Effect of HF&H2SO4 pretreatment on interfacial adhesion energy of Cu–Cu direct bonds”, Journal of Microelectronic Engineering, Vol. 89 p. 42–45, (2012).  (https://doi.org/10.1016/j.mee.2011.06.002)

Byung-Hyun Kwak, Myeong-Hyeok Jeong, Jae-Won Kim, Byunghoon Lee, Hoo-Jeong Lee, Young-Bae Park, "Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump", Microelectronic Engineering, Vol. 89, No. 1, 65-69 (2012).  (https://doi.org/10.1016/j.mee.2011.01.020)

Jae-Won Kim, Seong-Jae Jeon, Hak-Joo Lee, Seungmin Hyun and Young-Bae Park, “Improvement of wafer-level Cu-to-Cu bonding quality using wet chemical pretreatment”, Journal of Nanoscience and Nanotechnology, Vol. 12, p. 3577–3581, (2012).  (https://doi.org/10.1166/jnn.2012.5619)

Jae-Won Kim, Kwang-Seup Kim, Hak-Joo Lee, Hee-yeon Kim, Young-Bae Park, and Seungmin Hyun, "Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system", Journal of the Microelectronics & Packaging Society, Vol. 18, No. 4, p. 181-18. (2011).  (http://www.koreascience.or.kr/article/JAKO201108636391974.pdf)

Eun-Jung Jang, Jae-Won Kim, Bioh Kim, Thorsten Matthias, and Young-Bae Park, "Annealing Temperature Effect on the Cu-Cu Bonding Energy for 3D-IC Integration", Metals and Materials International, Vol. 17, No. 1, p. 105-109, (2011).  (https://doi.org/10.1007/s12540-011-0214-0)

Jae-Won Kim , Myeong-Hyeok Jeong , Erkan Carmak , Bioh Kim , Thorsten Matthias , Hak-Joo Lee , Seungmin Hyun and Young-Bae Park, "Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds", Vol. 17, No. 4, p. 61-66. 2010. (https://www.koreascience.or.kr/article/JAKO201015537945017.pdf)

Jae-Won Kim, Myeong-Hyeok Jeong, Eun-Jung Jang, Sung-Cheol Park, Erkan Cakmak, Bioh Kim, Thorsten Matthias, Sungdong Kim and Young-Bae Park, "Effect of Bonding Process Conditions on the Interfacial Adhesion Energy of Al-Al Direct Bonds", Vol. 20, No. 6,319-325, (2010).  (https://koreascience.or.kr/article/JAKO201019657415931.pdf)